Efabless Logo

matt_test

Efabless

COMING SOON²

EFSRAM_00064x016_008_18

Overview

This is a 64 words by 16 bits commercial grade low power embedded Single Port Synchronous (flow through) SRAM in SKY130 technology. An active high read-write enable signal controls the read/write operation of the memory. When bit-enable is high and readwrite enable is low, data on the data input pin is written into the memory location addressed by the address present on the address pins. Reading the device is accomplished while read-write enable is high. Under these conditions, the contents of the location addressed by the information on address lines is present on the data output pin. In write cycle, data to be written is driven onto data output pin. If there is no read or write, while memory is enabled, data output pin will hold previous data.

Memory dimesions in SKY130 technology: 213.470 $$um$$ x 84.565 um = 0.018 mm$$^2$$. ²²²²²²²²²²²²

Memory Features:

  • Synchronous Read-Write
  • Active High Bit Enables
  • Single Read-Write Enable (Low = write, High = read)
  • Write on a bit basis
  • Separate pins for data input and data output
  • Separate Power Supplies for core and periphery
  • Body bias option
  • Scan Chain Testmode
  • Wafer Level Burn-In Testmode
  • Option to switch off all wordlines while chip is enabled
  • Option for Power Switch
  • Clock Gating

Pin Description

NAME TYPE DIRECTION DESCRIPTION
AD [5:0] CMOS IN This input value selects the location to be read during a read cycle, and the location to be written during a write cycle. It is sampled on rising edge of clock.
R_WB CMOS IN This is the read/write control and sampled on rising edge of clock. When R_WB is high, the memory is in a read cycle mode. When R_WB is low, the memory is in write cycle mode.
CLKin CMOS IN Clock synchronizes the operations of the memory. All inputs are sampled on rising edge of clock.
BEN [15:0] CMOS IN Each bit of the BEN bus selects one bit of the DI bus. When one or more BEN inputs are high (active), and R_WB is low (write enabled) then the selected bits will be written into the memory.
DI [15:0] CMOS IN This data is written into the memory location selected by addr inputduring the write cycle. It is ignored during a read cycle.
EN CMOS IN EN (Chip Enable) is high (and TM low), read and write operation is performed.
TM CMOS IN When TM (Testmode)is high, memory is in testmode and normal memory operation is disabled. Inputs are tied to outputs through scan chain logic.
SM CMOS IN When SM (Scan chain control) is high, output of a input register is passed to next register. When low, input register receives input from input pin.
WLBI CMOS IN Wafer Level Burn-In Test mode control: When high, all wordlines are ON.
WLOFF CMOS IN Normal operation when low. All wordlines are clamped to vnb when high.
ScanInCC CMOS IN Input to Address and Control scan chain. ScanInDL
ScanInDL CMOS IN Input to Data scan chain (left side of the macro).
ScanInDR CMOS IN Input to Data scan chain (right side of the macro).
DO [15:0] CMOS OUT Data from the memory location selected by address is driven onto DO during a read cycle. In a write cycle, data to be written is driven onto DO. If there is no read or write, while memory is enabled, DO will hold previous data.
ScanOutCC CMOS OUT Output of Scan Chain of address and control pins. Note - DO is output of scan chain of data input pins.

Without the Power Switch feature enabled (default recommended mode)

NAME TYPE DIRECTION DESCRIPTION
vpwrm Supply IN Connect vpwrm to core power supply vpwra
vpwra Supply IN Nominal 1.8 power supply to memory array
vpwrp Supply IN Nominal 1.8 power supply to periphery
vpwrac Supply IN Connect vpwrac to core power supply vpwra
vpwrpc Supply IN Connect vpwrpc to core power supply vpwra
vgnd Supply IN Nominal 0 V power supply (ground).
vpb Bias Voltage IN Nwell connection, tie to the maximum power supply (can be vpwra or vpwrp)
vnb Bias Voltage IN Pwell connection, nominally equal to vgnd

With the Power Switch feature enabled

NAME TYPE DIRECTION DESCRIPTION
vpwrm Supply IN Nominal 1.8 main power supply
vpwra Supply IN power supply to memory array (internal node)
vpwrp Supply IN power supply to periphery (internal node)
vpwrac Supply IN Control signal to turn on the power supply to periphery (active LOW, CMOS)
vpwrpc Supply IN Control signal to turn on the power supply to core (active LOW, CMOS)
vgnd Supply IN Nominal 0 V power supply
vpb Bias Voltage IN Nwell connection, tie to the maximum power supply (can be vpwrm)
vnb Bias Voltage IN Pwell connection, nominally equal to vgnd

Specifications

DC Specifications

Conditions

  • Process Condition : Typical
  • Junction Temperature : 25.000 deg C
  • Operating Voltage : 1.800 V
  • Operating Frequency : 100 MHz

Power Dissipation When R_WB=HIGH

  • READ Active = 23.676 pJ
  • READ Active = 2.631 mA
  • READ Peak = 22.422 mA

Power Dissipation When R_WB=LOW

  • WRITE Active = 22.529 pJ
  • WRITE Active = 2.503 mA
  • WRITE Peak = 24.957 mA

Power Dissipation When EN=LOW, All Other Inputs Switching

  • Standby = 0.184 pJ
  • Standby = 0.020 mA
  • Standby Peak = 0.457 mA

Power Dissipation When TM=HIGH, Clock Switching

  • Test Mode = 6.133 pJ
  • Test Mode = 0.681 mA
  • Test Peak = 16.581 mA

Leakage: Power switches ON, Disabled (EN=LOW)

  • Power = 11397.800 pW
  • Current = 6.329 nA

**Leakage - One or More Power switches OFF (VPWRPC=HIGH or VPWRAC=HIGH)

  • Power = 134.106 pW
  • Current = 0.071 nA

AC Specifications

Conditions

  • Process Condition : Typical
  • Junction Temperature : 25.000 deg C
  • Operating Voltage : 1.800 V
  • Operating Frequency : 100 MHz
DESCRIPTION SYMBOL MIN SPEC (ns) MAX SPEC (ns) ACTUAL (ns)
Cycle Time Tcyc 8
Clock High Time Tchi 4
Clock Low Time Tclo 4
Clock to data-out (Read Cycle) Trd 0.5 4.74 Rise: 2.401 Fall: 2.415
Clock to data-out (Write Cycle) Twr 0.5 4.04 Rise: 2.001 Fall: 2.015
Setup time of addr/ctrl to clk Tsad 0.5 Rise: 0.527 Fall: 0.617
Setup time of EN to clock Tsen 1.3 1.376
Hold time of addr/ctrl from clk Thad 0.7 Rise: 0.326 Fall: 0.325
Setup time of Data to clk Tsdi 0.7 0.832
Hold time of data from clk Thdi 1 0.486
Setup time of BEN to clk Tsben 0.7 0.821
Hold time of BEN from clk Thben 1 0.504

Test Mode Parameters

DESCRIPTION SYMBOL MIN SPEC (ns) MAX SPEC (ns) ACTUAL (ns)
Clock to data-out (Test Mode) Tcotm 0.150 3.570 Rise: 1.621 Fall: 1.635
Clock to ScanOutC (Test Mode) Tcotm 0.150 3.570 Rise: 1.748 Fall: 1.735
Setup time of Add & Control to clk (Test Mode) Tsctl_tm 0.800 Rise: 0.849 Fall: 0.878
Hold time of Add & Control to clk (Test Mode) Thctl_tm 0.550 Rise: 0.574 Fall: 0.568
Setup time of TM, SM to clk Tstm 6.500 6.500
Hold time of TM, SM from clk Thtm 1.000 1.000

Summary

Catalog ID

MATT_TEST

Provider

Foundry

Vendor

Efabless

Node

28nm

Foundry

LFoundry

Category

External Oscillator

Licensing

Info

Commercial (Paid)

Quality

Certification

Uncertified

Maturity

Defined